A novel placement method for mini-scale passive components in surface mount technology

This paper aims to propose a novel placing method, i.e., place-between-paste-and-pad (PB), for mini-scale passive components enhance electronic assembly lines’ yield. PB means component is designed be placed at the midpoint between pastes and pads on length direction while it aligns with pads’ center width direction. An experiment that involves 12 printed circuit boards (PCB) 4500 resistors R0402M (0.40 mm × 0.20 mm) conducted get comparative results of two industrial methods, place-on-pad place-on-paste. Based this experiment’s results, outperforms other methods in terms minimizing components’ final misalignment. Furthermore, low-cost strategy because does not need real-time communication solder paste inspection machine pick-and-place machine. The placement method proposed study expected offer exploration procedure surface mount quality components.